Date: 07 November 2018
Location: ICS International Congress Center Stuttgart, east entrance

The goal of this meeting was to integrate the entire value chain of Hyperspectral Imaging technology in all its applications from ground based microscopes and spectrometers to satellite sensors and astrophysical data in aerospace.

The discussion focused on application requirements mainly in industrial inspection and machine vision, as well as other potential markets such as automotive and aerospace electronics, pollution control, precision agriculture, chemistry and biomedical imaging, defence applications, aerospace, etc. A high level of participation from component and module manufacturers (e.g. spectrometers, cameras, sensors, thin film filters, scanners, optical devices, VIS/NIR light sources, etc.) to users in the above market segments waited for the visitors.

 

Programme

09:30 am – 10:00 am    
Welcoming coffee and registration

10:00 am – 10:10 am    
Welcoming words by Jose Pozo, CTO, EPIC – European Photonics Industry Consortium (Europe)

10:10 am – 10:15 am    
Welcoming words by Florian Niethammer,  Team Director of VISION trade show, Messe Stuttgart (Germany)

10:15 am – 10:30 am    
3D and snapshot hyperspectral cameras based on continuously variable filters – Oliver Pust, Director Sales and Marketing, Delta Optical Thin Film (Denmark)

10:30 am – 10:45 am    
An intelligent versatile multispectral imaging system – Andrea Dunbar, Sector Head, Embedded Vision Systems, CSEM (Switzerland)

10:45 am – 11:00 am     
Hyperspectral and multispectral imaging: applications and market trends – Thierry Robin, Partner, Tematys (France)

11:00 am – 11:15 am    
UV to SWIR OEM hyperspectral imaging systems for industry 4.0 – Arnaud Cotel, Sales and Marketing Director, HORIBA (France)

11:15 am – 11:30 am    
A spectrometer in each pixel: technology and application examples from Finland – Philippe Monnoyer, Customer Account Lead, VTT (Finland)

11:30 am – noon           
Coffee break

noon – 12:15 pm         
Heat-sealed joint inspection with hyperspectral imaging – Dietmar Serbee, Managing Director, Stemmer Imaging (The Netherlands)

12:15 pm – 12:30 pm 
Using image sensor sockets to reduce the cost and time involved in high speed/high resolution camera production – Scott Tate, VP, Andon Electronics (USA)

12:30 pm – 12:45 pm    
Spectral X-ray-imaging for non-destructive testing – Max Wunderlich, Business Development, Polytec (Germany)

12:45 pm – 01:00 pm  
CMOS based Hyperspectral imaging: Promises, Challenges, Pitfalls – Jerome Baron, Business Development Manager – Hyperspectral Imaging, imec (Belgium)

01:00 pm – 01:10 pm  
Discussion and closing remarks – Jose Pozo, CTO, EPIC – European Photonics Industry Consortium (Europe)

Impressions 2018