Electronics Production Forum

The Electronics Production Forum will supplement the joint stand. The programme will take place at the Speakers' Corner (A1.124) from 09:30 to 12:30 on 24 January 2024 and from 09:30 to 12:30 on 25 January 2024.

The programme is being organised by the Trade Association for Electronics Design and Production (FED). The FED represents the interests of 700 members, including printed circuit board designers and manufacturers, EMS companies, EDA companies, suppliers of process and technology services, as well as suppliers of production systems, software and consumables. The FED provides its members in Germany, Switzerland and Austria with guidance and support regarding technical business processes and decisions. The focal points of the Association's work are the processing and communication of technical know-how, as well as on-the-job training of electronics designers and electronics specialists.

Programme on 24.01.2024

TimeSpeakerCompanyTitleContents
09:30 – 10:05Thomas KirchnerZestron EuropeCleaning before coatingGo to the abstract
10:05 - 10:40Olaf RömerATECARE SERVICE GMBH & CO.KGUse of AI in testing technology – does it make sense and how advanced is the technology now?Go to the abstract
10:40 - 11:15Sven PörschkeMacDermid AlphaEnvironmental advantages of a closed loop – recycling of rinsing water with direct metallisation in PCB productionGo to the abstract
11:15 - 11:50Stefan Burmeister        

beflex A Katek Brand           

Obsolescence-Management für elektronische Baugruppen - ein wesentlicher Einfluss auf die Lieferfähigkeittba.
11:50 - 12:25Jens MilleGÖPEL electronic GmbHIncreased efficiency in production Go to the abstract

Programme on 25.01.2024

TimeSpeakerCompanyTitleContent
09:30 – 10:05Udo Grimmer-HerklotzFelder GmbHSoldering agents for repairs and ecologically sustainable soldering agents and soldering agent productiontba
10:05 - 10:40Heiko LübbertSPEA GmbHThe flying probe tester as a multi-function testerGo to the abstract
10:40 - 11:15

Helge Schimanski

Fraunhofer-Institut für Siliziumtechnologie ISIT 

Anwendungsstudie zum Niedertemperaturlöten

Go to the abstract
11:15 - 11:50Helge SchimanskiFraunhofer Institute for Silicon Technology (ISIT)Advanced error analysis as a basis for reliable electronics – optimisation of production processes through root cause analysisGo to the abstract
11:50 - 12:25Axel WolffViscom AGTHT inspection – unmatched 3D AOI for underside quality controlGo to the abstract