Electronics Production Forum
The Electronics Production Forum will supplement the joint stand. The programme will take place at the Speakers' Corner (A1.124) from 09:30 to 12:30 on 24 January 2024 and from 09:30 to 12:30 on 25 January 2024.
The programme is being organised by the Trade Association for Electronics Design and Production (FED). The FED represents the interests of 700 members, including printed circuit board designers and manufacturers, EMS companies, EDA companies, suppliers of process and technology services, as well as suppliers of production systems, software and consumables. The FED provides its members in Germany, Switzerland and Austria with guidance and support regarding technical business processes and decisions. The focal points of the Association's work are the processing and communication of technical know-how, as well as on-the-job training of electronics designers and electronics specialists.
Programme on 24.01.2024
Time | Speaker | Company | Title | Contents |
09:30 – 10:05 | Thomas Kirchner | Zestron Europe | Cleaning before coating | Go to the abstract |
10:05 - 10:40 | Olaf Römer | ATECARE SERVICE GMBH & CO.KG | Use of AI in testing technology – does it make sense and how advanced is the technology now? | Go to the abstract |
10:40 - 11:15 | Sven Pörschke | MacDermid Alpha | Environmental advantages of a closed loop – recycling of rinsing water with direct metallisation in PCB production | Go to the abstract |
11:15 - 11:50 | Stefan Burmeister | beflex A Katek Brand | Obsolescence-Management für elektronische Baugruppen - ein wesentlicher Einfluss auf die Lieferfähigkeit | tba. |
11:50 - 12:25 | Jens Mille | GÖPEL electronic GmbH | Increased efficiency in production | Go to the abstract |
Programme on 25.01.2024
Time | Speaker | Company | Title | Content |
09:30 – 10:05 | Udo Grimmer-Herklotz | Felder GmbH | Soldering agents for repairs and ecologically sustainable soldering agents and soldering agent production | tba |
10:05 - 10:40 | Heiko Lübbert | SPEA GmbH | The flying probe tester as a multi-function tester | Go to the abstract |
10:40 - 11:15 | Helge Schimanski | Fraunhofer-Institut für Siliziumtechnologie ISIT | Anwendungsstudie zum Niedertemperaturlöten | Go to the abstract |
11:15 - 11:50 | Helge Schimanski | Fraunhofer Institute for Silicon Technology (ISIT) | Advanced error analysis as a basis for reliable electronics – optimisation of production processes through root cause analysis | Go to the abstract |
11:50 - 12:25 | Axel Wolff | Viscom AG | THT inspection – unmatched 3D AOI for underside quality control | Go to the abstract |