Overview

Bondexpo

Bondexpo
International Trade Fair for Bonding Technology

  • Date  – 
  • Venue Messe Stuttgart
  • Organiser P. E. Schall GmbH & Co. KG
  •  Cycle every year

With the Bondexpo international trade fair for bonding technology, exhibition company P. E. Schall GmbH & Co. KG has succeeded in establishing the worldwide number one user meeting place within a very short period of time. With a clear and consistent focus on the process chain of joining/bonding by means of gluing, moulding, sealing and foaming, detailed and system solutions are offered for present and future challenges in the field of joining and bonding the broadest range of materials.

Key exhibition areas

 

Raw materials for adhesives and sealantsMachines, systems and accessories for the adhesives manufacturing industry
Adhesives and sealantsMachines, systems and accessories for the adhesives processing industry
Sealing-, measuring and test technology

 

; Machinery, equipment and accessories for the adhesives manufacturing industry; Adhesives and sealants; Machinery, equipment and accessories for the adhesives (etc.) processing industry; Measuring and control systems; Services

Contact

Rainer Bachert
Simone Jenz
Gustav-Werner-Str. 6
72636 Frickenhausen
Deutschland

Rainer Bachert
Tel.: +49 (0)7025 9206-660
Fax: +49 (0)7025 9206-88660
Mailbachert(at)schall-messen.de

Simone Jenz
Tel.: +49 (0 7025 9206-641
Fax: +49 (0)7025 9206-88641
Mailjenz(at)schall-messen.de



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